Globalfoundries and Qualcomm ink partnership

09 January 2010

Globalfoundries and Qualcomm have entered into a non-binding memorandum of understanding to collaborate on leading edge technologies. Globalfoundries intends to provide Qualcomm with access to 45nm Low Power (LP) and 28nm (LP) technologies with an intended collaboration on future advanced process nodes. The two companies will also partner in other areas, including die-package interaction and three-dimensional packaging technologies.

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